Publication:
Improving the reliability of silicon diodes via manufacturing process modification strategies

dc.contributor.affiliation000000041762408X
dc.contributor.affiliation"Instituto de Cerámica y Vidrio, CSIC, Kelsen, 5, Madrid, 28049, Spain"," Fluorescence Imaging Group, Departamento de Física de Materiales, Facultad de Ciencias, Universidad Autónoma de Madrid28049, Spain"," IMDEA Nanociencia, C/Faraday, 9, Madrid, 28049, Spain"," SEG Automotive Germany GmbH, Lotterbergstraße 30, Stuttgart, 70499, Germany"en
dc.contributor.authorRomán-Sánchez S.
dc.contributor.authorParís Ogáyar M.
dc.contributor.authorLorite I.
dc.contributor.authorFernández J.F.
dc.contributor.authorSerrano A.
dc.contributor.authorMoure A.
dc.date.accessioned2024-02-09T11:54:04Z
dc.date.available2024-02-09T11:54:04Z
dc.date.issued2024
dc.format.mimetypeapplication/pdfen
dc.identifier.doi10.1016/j.jmrt.2023.12.155en
dc.identifier.urihttp://hdl.handle.net/20.500.12614/3536
dc.journal.titleJournal of Materials Research and Technologyen
dc.language.isoenes_ES
dc.page.initial3882en
dc.relation.projectIDTEMPThis work was supported by the Spanish Ministry for Science and Innovation (MCIN) under the projects PID2021-124585NB-C33 and PID2020-114192RB-C41 . S.R.-S. acknowledges the financial support from the FARDIO project to SEG Automotive Germany GmbH. M.P.O. acknowledges financial support from the Spanish Ministry of Universities , through the FPU program ( FPU20/03166 ). A.S. acknowledges the financial support from MCIN for a Ramón y Cajal contract (No. RYC2021-031236-I ), which is funded by the Recovery, Transformation and Resilience plan.
dc.rightsAtribución-NoComercial-SinDerivadas 3.0 España*
dc.rightsAtribución-NoComercial-SinDerivadas 3.0 España*
dc.rights.accessRightsopen accessen
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/*
dc.titleImproving the reliability of silicon diodes via manufacturing process modification strategiesen
dc.typeresearch articleen
dc.type.hasVersionVoRen
dc.volume.number28en
dspace.entity.typePublication

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