Interplay between Through-Space and Through-Bond Electronic Coupling in Singlet Fission

Thiel, D.Gotfredsen, H.Greißel, P.M.Chen, L.Krug, M.Papadopoulos, I.Ferguson, M.J.Clark, T.Neiß, C.Görling, A.Nielsen, M.B.Tykwinski, R.R.Guldi, D.M.Torres, Tomás2025-10-302025-10-302025https://hdl.handle.net/20.500.12614/4132enInterplay between Through-Space and Through-Bond Electronic Coupling in Singlet Fissionresearch article10.1021/jacs.5c10672