Publication:
Interplay between Through-Space and Through-Bond Electronic Coupling in Singlet Fission

Simple item page
dc.contributor.affiliation000000041762408X
dc.contributor.affiliationDepartment of Chemistry and Pharmacy, Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany; University of Alberta, Edmonton, Canada; Department of Chemistry, Københavns Universitet, Copenhagen, Denmark; Institute for Advanced Research in Chemical Sciences (IAdChem), Universidad Autónoma de Madrid, Madrid, Spain; IMDEA Nanociencia, Madrid, Spain; Nägelsbachstraße 25, Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany; Department of Chemistry and Pharmacy, Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany; Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germanyen
dc.contributor.authorThiel, D.
dc.contributor.authorGotfredsen, H.
dc.contributor.authorGreißel, P.M.
dc.contributor.authorChen, L.
dc.contributor.authorKrug, M.
dc.contributor.authorPapadopoulos, I.
dc.contributor.authorFerguson, M.J.
dc.contributor.authorClark, T.
dc.contributor.authorNeiß, C.
dc.contributor.authorGörling, A.
dc.contributor.authorNielsen, M.B.
dc.contributor.authorTykwinski, R.R.
dc.contributor.authorGuldi, D.M.
dc.contributor.authorTorres, Tomás
dc.date.accessioned2025-10-30T16:14:34Z
dc.date.available2025-10-30T16:14:34Z
dc.date.issued2025
dc.identifier.doi10.1021/jacs.5c10672en
dc.identifier.urihttps://hdl.handle.net/20.500.12614/4132
dc.journal.titleJournal of the American Chemical Societyen
dc.language.isoenen
dc.page.initial32124en
dc.relation.projectIDTEMPR.R.T. acknowledges funding from the Natural Sciences and Engineering Research of Canada (NSERC, grant no. RGPIN-2017-05052 and RGPIN-2023-04000) and the Canada Foundation for Innovation (CFI). H.G. thanks the Danish Ministry of Higher Education and Science for an EliteForsk travel Council scholarship (6161-00051B). T.T. acknowledges financial support from the Spanish MCIN/AEI/ 10.13039/ 1195 501100011033 (TED2021- 1196 131255B-C43), and MICIU /AEI /10.13039/501100011033 / FEDER, UE (PID2023-151167NB-I00), the Comunidad de Madrid and the Spanish State through the Recovery, Transformation and Resilience Plan [\u201CMateriales Disruptivos Bidimensionales (2D)\u201D (MAD2D-CM) (UAM1)-MRR Materiales Avanzados], and the European Union through the Next Generation EU funds. IMDEA Nanociencia acknowledges support from the \u201CSevero Ochoa\u201D Programme for Centres of Excellence in R&D (MINECO, Grant SEV2016-0686). T. T. also acknowledges the Alexander von Humboldt Foundation (Germany) for the A. v. Humboldt - J. C. Mutis Research Award 2023 (ref 3.3 - 1231125 - ESP-GSA). D.M.G. acknowledges funding from the Deutsche Forschungsgemeinschaft (GU 517/27-1 and GU 517/32-1).
dc.titleInterplay between Through-Space and Through-Bond Electronic Coupling in Singlet Fissionen
dc.typeresearch articleen
dc.volume.number147en
dspace.entity.typePublication
relation.isAuthorOfPublication64ff123a-bd77-4339-b4af-a8a86d733054
relation.isAuthorOfPublication.latestForDiscovery64ff123a-bd77-4339-b4af-a8a86d733054

Files

Collections

Publications